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Designers Notebook: PCB Designers Guide to Heterogeneous Chiplet Packaging
AUGUST 01, 2023
Integrating multiple chiplet elements on a single interposer or package substrate may be referred to as a multi-chip module, a hybrid IC, a 2.5D package or simply an advanced package. Implementing chiplet technology will provide several advantages over the traditional, system-on-chip alternative: Each chiplet element is designed to be a building block with a specific function that is often common for multiple system-level products. Chiplet elements can also be sourced from multiple providers, even though they may be using alternative fabrication processes.