Design Guidelines for Surface Mount & Microelectronic Technology

Design Guidelines for Surface Mount and Microelectronic Technology was written for the circuit board design specialist furnishing proven methods and techniques needed for developing a reliable and assembly process compatible product.
The text and illustrations furnished in this book were written by a designer for designers.

The book emphasizes why today’s design professional must be cognizant of the relationship between printed circuit board design, circuit board manufacturing, and circuit board assembly processing. Readers will find that the detailed information is useful to several disciplines, including product design specialists, material procurement professionals, and those responsible for manufacturing, assembly and product testing.

Each section of the book is written, illustrated and detailed to guide the user in the implementation of process-proven SMT and microelectronic packaging methods and techniques. The book provides the reader with step-by-step procedures in developing the most cost-effective product possible. Also defined are details related to device standards, alternative semiconductor packaging methods, and high-density circuit fabrication options.

Want to Stay Updated?
Be the first to know when Design Guidelines for Surface Mount & Microelectronic Technology launches!

Simply fill out the form below, and we’ll send you a notification as soon as the book is available.