Category: 2023

  • Designers Notebook: Flexible Circuits for In-line SMT Assembly Processing

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    EirikSolberg
    in ,

    JANUARY 20, 2023 Incorporating surface mount components directly onto a flexible circuit’s etched copper land patterns is not unlike the assembly process used for rigid circuit boards. To maximize robotic assembly efficiency and increase throughput of the flexible circuit, however, the circuit design engineer will need to provide a format that includes all features required…

  • Designer’s Notebook: PCB Design for Bare Board Testing

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    EirikSolberg
    in

    MARCH 22, 2023 There are several testing methods used for certifying that the circuit board meets its defined quality level and intended functional criteria. Multilayer circuit boards have become increasingly complex: finer conductor line definition, blind and buried microvia interface, and smaller, finer-pitch SMT land pattern geometries. Visual assessment using automated optical inspection (AOI) is…

  • Designers Notebook: PCB Designers Guide to Heterogeneous Chiplet Packaging

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    EirikSolberg
    in

    AUGUST 01, 2023 Integrating multiple chiplet elements on a single interposer or package substrate may be referred to as a multi-chip module, a hybrid IC, a 2.5D package or simply an advanced package. Implementing chiplet technology will provide several advantages over the traditional, system-on-chip alternative: Each chiplet element is designed to be a building block with…

  • Designer’s Notebook: DFM Principles for Flexible Circuits

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    by

    EirikSolberg
    in

    SEPTEMBER 14, 2023 Flexible circuit applications can be as basic as furnishing electrical interconnect between two conventional circuit board assemblies, or to prove a platform for placing and interconnecting electronic components. During the planning and pre-design phase of the flexible circuit, there will be several material and process related questions that need to be addressed.…