Designer’s Notebook: Heterogeneous Integration and High-density SiP Technologies

Often, our primary goal is to maximize product functionality without increasing product size. Developing a multi-function silicon-based semiconductor (system-on-chip) for a specific product application, however, requires a significant investment in both engineering and financial resources. The problem is that many of the newer generations of semiconductor die have actually increased in size, with higher I/O and terminal pitch variations that have become significantly smaller. 

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