Category: 2024

JANUARY 25, 2024 The designer needs to have a working understanding of two key manufacturing operations: basic circuit board fabrication procedures and assembly process practices. For printed circuit board manufacturing, the number of steps required to produce the printed circuit board correlates to the circuit board’s complexity. Greater process complexity in fabricating the circuit board equates…

APRIL 24, 2024 The printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or…

AUGUST 06, 2024 Surface mount technology (SMT) is a manufacturing process that, through the application of a wide range of small outline components, provides capability to design a printed circuit with higher component density. The assembly process offers the user a means of efficiently producing electronic products in high volume with robotic assembly processing. The…

Often, our primary goal is to maximize product functionality without increasing product size. Developing a multi-function silicon-based semiconductor (system-on-chip) for a specific product application, however, requires a significant investment in both engineering and financial resources. The problem is that many of the newer generations of semiconductor die have actually increased in size, with higher I/O…