Description
Designer Guidelines for Surface Mount and Microelectronic Technology was written for the circuit board design specialist furnishing proven methods and techniques needed for developing a reliable and assembly process compatible product. The text and illustrations furnished in this book were written by a designer for designers.
The book emphasizes why today’s design professional must be cognizant of the relationship between printed circuit board design, circuit board manufacturing, and circuit board assembly processing. Readers will find that the detailed information is useful to several disciplines, including product design specialists, material procurement professionals, and those responsible for manufacturing, assembly and product testing.
Each section of the book is written, illustrated and detailed to guide the user in the implementation of process-proven SMT and microelectronic packaging methods and techniques. The book provides the reader with step-by-step procedures in developing the most cost-effective product possible. Also defined are details related to device standards, alternative semiconductor packaging methods, and high-density circuit fabrication options.
About the Author-
Vern Solberg is renowned for his work as an author and educator with over forty years of experience in surface mount, microelectronic design, and manufacturing technology. His outstanding achievements are recognized by prestigious organizations such as the Surface Mount Technology Association (SMTA), and the IPC Standards Organization.
In addition, Solberg has made significant contributions in creating a number of industry standards related to surface mount technology. Acting as chairman and co-chair, he performed a principal role in developing the IPC-7900 series of design and process implementation standards documents for BGA, FBGA, Embedded Component and 3D Microelectronic Package Technologies.
Working in the high-tech environment of California’s Silicon Valley, Vern aspired to develop electronic products that met the criteria for manufacturing efficiency and reliability. And, in his role as a design engineer for a prominent semiconductor package development company, he solved a number of challenging manufacturing related issues and has been awarded multiple patents for semiconductor packaging including the innovative 3D folded-flex semiconductor package technology.
As an independent consultant, he now shares his expertise through technical papers, his Design 007 Magazine columns, and books. He is the author of two books published by McGraw-Hill; , Design Guidelines for Surface Mount Technology and Design Guidelines for Surface Mount and Fine-Pitch Technology. This book, Design Guidelines for Surface Mount and Microelectronics, is validation to his expertise and dedication for advancing the field of SMT design for manufacturing.
Solberg’s ultimate goal in publishing this book is to furnish practical guidance for current and future generations of PCB Design Engineers into the world of surface mount and microelectronic technology.